The 3rd Annual Dieline Package Design Conference is coming up in 2 weeks – June 23rd to 26th to be exact. We will be there. The question is, will you? From our Sausalito office, Will Burke, Principal & Chief Innovation Officer, will be speaking at the conference.
What will Will be speaking about, you ask?
He will be bringing a unique cultural perspective to a very thought-provoking problem in our industry: Bad Package Design is Everywhere.
The Americans think the Europeans have got it right. And the Europeans think the Americans have it right. Who’s right? Take an insightful look at the multicultural world of package design, and judge for yourself what is bad design and how we can avoid it. Learn the bad habits that lead to bad design and how to avoid them.
Have you fallen victim to bad habits? Have a story to share? Will could chat on this topic for hours. Sadly, he only has 45 minutes. Mark your calendar for Tuesday, June 25th at 3:45pm. This is one session you won’t want to miss. And since this is Summer in San Francisco bring your jacket and possibly an umbrella!
Learn more at The Dieline Package Design Conference.
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